QUALITY ASSURANCE – PROCESS
Design validation for continuous testing ( minimum 6 months and above) of newly developed products.
PCBs with high Thermal Quoficient (TC) to ensure faster heat transfer.
LEAD FREE – soldering for strong LED bonding and and reduced junction temperature.
Thermal design techniques using multi probe heat tracking method .
Routine test method complete for 100% products – with accurate record keeping and with UNIQUE IDENTITY marking on each product.
Type Testing method for all products – with Low / High voltage test.
Ageing Test ( 100% products are subjected to agening test – with 350 cycles representing 1000 days of field operation – ensuring zero failure at clients end.
Using best in class components
a. LED – Osram / Brigelux/ Citizen
b. Drivers : BAG , Pyrotech
c. PCB – 1.6 mm / 2 TC type
d. Cables – Finolex make
e. Solder paste: ALPHA make
f. Solder wire: BOND make
g. Thermal Paste : Dow Corning
h. Silicone Sealants : Dow Corning.
a. LED – Osram / Brigelux/ Citizen
b. Drivers : BAG , Pyrotech
c. PCB – 1.6 mm / 2 TC type
d. Cables – Finolex make
e. Solder paste: ALPHA make
f. Solder wire: BOND make
g. Thermal Paste : Dow Corning
h. Silicone Sealants : Dow Corning.
Unique last stage thermal protection to ensure zero failure – in worst condition of usage.